JPS6061748U - 発光ダイオ−ドアセンブリ - Google Patents

発光ダイオ−ドアセンブリ

Info

Publication number
JPS6061748U
JPS6061748U JP1983154482U JP15448283U JPS6061748U JP S6061748 U JPS6061748 U JP S6061748U JP 1983154482 U JP1983154482 U JP 1983154482U JP 15448283 U JP15448283 U JP 15448283U JP S6061748 U JPS6061748 U JP S6061748U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
diode assembly
wiring pattern
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983154482U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0328528Y2 (en]
Inventor
茂 坂口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Tottori Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tottori Sanyo Electric Co Ltd, Sanyo Electric Co Ltd filed Critical Tottori Sanyo Electric Co Ltd
Priority to JP1983154482U priority Critical patent/JPS6061748U/ja
Publication of JPS6061748U publication Critical patent/JPS6061748U/ja
Application granted granted Critical
Publication of JPH0328528Y2 publication Critical patent/JPH0328528Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Landscapes

  • Dot-Matrix Printers And Others (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Structure Of Printed Boards (AREA)
JP1983154482U 1983-10-04 1983-10-04 発光ダイオ−ドアセンブリ Granted JPS6061748U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983154482U JPS6061748U (ja) 1983-10-04 1983-10-04 発光ダイオ−ドアセンブリ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983154482U JPS6061748U (ja) 1983-10-04 1983-10-04 発光ダイオ−ドアセンブリ

Publications (2)

Publication Number Publication Date
JPS6061748U true JPS6061748U (ja) 1985-04-30
JPH0328528Y2 JPH0328528Y2 (en]) 1991-06-19

Family

ID=30341472

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983154482U Granted JPS6061748U (ja) 1983-10-04 1983-10-04 発光ダイオ−ドアセンブリ

Country Status (1)

Country Link
JP (1) JPS6061748U (en])

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5780077A (en) * 1980-11-06 1982-05-19 Matsushita Electric Ind Co Ltd Heat-sensitive recording head

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5780077A (en) * 1980-11-06 1982-05-19 Matsushita Electric Ind Co Ltd Heat-sensitive recording head

Also Published As

Publication number Publication date
JPH0328528Y2 (en]) 1991-06-19

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